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With the merger in 1963 of the IRE and the American Institute of Radio Engineers, EDS became a technical group under the newly formed IEEE. 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This workshop will provide a unique platform for young professionals to showcase their exciting research in emerging microelectronic devices and engage professionals from different career stages to discuss the opportunities and challenges in their career. \u003C/span>\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cbr>\u003Cspan style=\"background-color:transparent;color:#000000;\">Join IEEE EDS for free with promotion code: \u003Cstrong>EDS2025_DRC\u003C/strong>\u003C/span>\u003Cbr> \u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#c00000;font-size:1.5rem;\">\u003Cstrong>Date:\u003C/strong> \u003C/span>\u003Cspan style=\"background-color:transparent;color:#000000;font-size:1.5rem;\">June 22, 2025\u003C/span>\u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#c00000;font-size:1.25rem;\">\u003Cstrong>Agenda:\u003C/strong>\u003C/span>\u003C/p>\u003Cfigure class=\"table\">\u003Ctable>\u003Cthead>\u003Ctr>\u003Cth>TImes\u003C/th>\u003Cth>Presentation/Event\u003C/th>\u003Cth>Presenter/Participants\u003C/th>\u003C/tr>\u003C/thead>\u003Ctbody>\u003Ctr>\u003Ctd>8:30 - 8:40 AM\u003C/td>\u003Ctd>Welcome and Introduction\u003C/td>\u003Ctd>Yuxuan Cosmi Lin (TAMU)\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd>8:40 - 10:10 AM\u003C/td>\u003Ctd colspan=\"2\">\u003Cstrong>Session 1: Technical Presentations\u003C/strong>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd> \u003C/td>\u003Ctd>Extreme Scaling of Transistor Technology based on 2D Semiconductors\u003C/td>\u003Ctd>Xu Zhang (CMU)\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd> \u003C/td>\u003Ctd>Field-Effect Transistors at the Edge: GaN Devices for Extreme Environments\u003C/td>\u003Ctd>Savannah Eisner (Columbia)\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd> \u003C/td>\u003Ctd>Novel Nanoelectronics for Emerging Memory Technology\u003C/td>\u003Ctd>Sourav Dutta (UT Dallas)\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd>10;10 - 10:30 AM\u003C/td>\u003Ctd colspan=\"2\">AM Coffee Break\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd>10:30 - 11:30 AM\u003C/td>\u003Ctd>\u003Cstrong>Session 2: Panel Discussion\u003C/strong>\u003Cbr>Opportunities and Challenges for Young Professional to Work in the Exciting Era of Microelectronics \u003C/td>\u003Ctd>Moderator: Sourav Dutta (UT Dallas)\u003Cbr>\u003Cbr>Panelists: Eli Yablonovitch (UC Berkeley), Xu Zhang (CMU), Kexin Li (ASU), Greg Pitner (TSMC), Chad Husko (Iris Light Technologies)\u003C/td>\u003C/tr>\u003C/tbody>\u003C/table>\u003C/figure>",{"id":793,"__component":784,"componentVariation":785,"styles":794,"header":796,"body":798},47,{"id":148,"edgeTop":51,"edgeBottom":51,"background":795,"containerWidth":13},"base-50",{"id":246,"heading":797,"prose":48,"lead":13,"eyebrow":13,"badge":13,"componentVariation":788,"containerWidth":13,"image":13},"Content",{"id":799,"title":13,"body":800,"containerWidth":13,"buttonGroup":13,"media":13},50,"\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;font-size:1.5rem;\">\u003Cstrong>Extreme Scaling of Transistor Technology based on 2D Semiconductors\u003C/strong>\u003C/span>\u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci>Xu Zhang\u003C/i>\u003C/span>\u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci>Department of Electrical and Computer Engineering, Carnegie Mellon University\u003C/i>\u003C/span>\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cspan style=\"background-color:transparent;color:#000000;\">The atomically thin body thickness of two-dimensional (2D) semiconductors, especially 2D transition metal dichalcogenides (TMDCs), makes them ideal for ultimate scaling while maintaining a tight gate electrostatic control over channel. Unlike silicon, the dangling-bond-free nature of 2D semiconductors makes their carriers’ mobility largely immune to thickness scaling. It holds great prospects in enabling scaling electronic devices, for both computing and memory applications, down to a territory that would be fundamentally challenging for conventional 3D semiconductors, such as silicon and germanium. In this talk, we will share recent advances on the scalable fabrication of MoS\u003Csub>2\u003C/sub> electronics devices with sub-5-nm channel length. A combined experimental and theoretical investigation was done to systematically study their quantum transport behavior, benchmarked against the state-of-the-art transistor technologies.\u003C/span>\u003C/p>\u003Chr>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;font-size:1.5rem;\">\u003Cstrong>Field-Effect Transistors at the Edge: GaN Devices for Extreme Environments\u003C/strong>\u003C/span>\u003Cbr>\u003Cbr>\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci>Savannah Eisner\u003C/i>\u003C/span>\u003Cbr>\u003Cbr>\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci>Department of Electrical Engineering, Columbia University\\\u003C/i>\u003C/span>\u003C/p>\u003Cp>\u003Cspan style=\"background-color:transparent;color:#000000;\">Emerging applications in space exploration, nuclear energy, and advanced medical technologies are pushing electronic systems to their limits in terms of temperature, radiation, and reliability. This talk highlights recent and ongoing efforts in developing GaN-based high electron mobility transistors (HEMTs) for extreme environments. I will discuss our work on high-temperature InAlN/GaN platforms, initial testing under simulated Venus surface conditions, and emerging architectures for radiation-tolerant sensing — including potential applications in real-time monitoring for FLASH radiotherapy and harsh nuclear environments. These developments illustrate how field-effect transistors remain a foundational technology, even as we expand their use far beyond traditional domains.\u003C/span>\u003C/p>\u003Chr>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;font-size:1.5rem;\">\u003Cstrong>Novel Nanoelectronics for Emerging Memory Technology \u003C/strong>\u003C/span>\u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci>Sourav Dutta\u003C/i>\u003C/span>\u003C/p>\u003Cp style=\"text-align:center;\">\u003Cspan style=\"background-color:transparent;color:#000000;\">\u003Ci> Department of Electrical and Engineering, University of Texas at Dallas\u003C/i>\u003C/span>\u003C/p>\u003Cp>\u003Cspan style=\"background-color:transparent;color:#000000;\">With SRAM and DRAM technologies facing scaling challenges, emerging materials and devices involving ferroelectrics and amorphous oxide semiconductors are gaining attraction for next generation memory technology designs. These novel materials and devices however come with new physics and phenomena at the atomic scale that needs to be understood in order to address some of the reliability challenges. This talk will delve into understanding the reliability challenges, connecting them to different physics at the materials and device level, and help us solidify our understanding of these new materials and devices for memory applications.\u003C/span>\u003C/p>",{"id":50,"__component":802,"componentVariation":803,"styles":804,"header":13,"contactGroup":805},"content.contacts","Contacts Flex Card Image Cover",{"id":221,"edgeTop":51,"edgeBottom":51,"background":13,"containerWidth":13},[806],{"id":135,"groupTitle":13,"contacts":807},[808,852,891,931,974,1008,1031],{"id":809,"contact":810},111,{"id":811,"name":812,"committee":13,"position":13,"affiliation":813,"email":13,"biography":48,"createdAt":814,"updatedAt":814,"url_path_id":815,"contactPhoto":816,"socialLinks":850,"url_path":851},145,"Dr. Yuxuan Cosmi Lin","Department of Materials Science & Engineering, Texas A&M University","2025-05-16T11:26:34.567Z","204",{"id":817,"name":818,"alternativeText":13,"caption":13,"width":819,"height":820,"formats":821,"hash":846,"ext":761,"mime":764,"size":847,"url":848,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":849,"updatedAt":849},127,"Headshot_Lin.jpg",2831,2787,{"large":822,"small":828,"medium":834,"thumbnail":840},{"ext":761,"url":823,"hash":824,"mime":764,"name":825,"path":13,"size":826,"width":675,"height":827},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/large_Headshot_Lin_fec2b2d370.jpg","large_Headshot_Lin_fec2b2d370","large_Headshot_Lin.jpg",74.33,984,{"ext":761,"url":829,"hash":830,"mime":764,"name":831,"path":13,"size":832,"width":681,"height":833},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/small_Headshot_Lin_fec2b2d370.jpg","small_Headshot_Lin_fec2b2d370","small_Headshot_Lin.jpg",23.02,492,{"ext":761,"url":835,"hash":836,"mime":764,"name":837,"path":13,"size":838,"width":687,"height":839},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/medium_Headshot_Lin_fec2b2d370.jpg","medium_Headshot_Lin_fec2b2d370","medium_Headshot_Lin.jpg",45.28,738,{"ext":761,"url":841,"hash":842,"mime":764,"name":843,"path":13,"size":844,"width":845,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_Headshot_Lin_fec2b2d370.jpg","thumbnail_Headshot_Lin_fec2b2d370","thumbnail_Headshot_Lin.jpg",4.47,158,"Headshot_Lin_fec2b2d370",550.67,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/Headshot_Lin_fec2b2d370.jpg","2025-05-16T11:26:32.449Z",[],"-180",{"id":853,"contact":854},112,{"id":855,"name":856,"committee":13,"position":13,"affiliation":857,"email":13,"biography":48,"createdAt":858,"updatedAt":858,"url_path_id":859,"contactPhoto":860,"socialLinks":889,"url_path":890},139,"Dr. Xu Zhang","Department of Electrical and Computer Engineering, Carnegie Mellon University","2025-05-16T11:20:38.479Z","198",{"id":861,"name":862,"alternativeText":13,"caption":13,"width":863,"height":863,"formats":864,"hash":885,"ext":761,"mime":764,"size":886,"url":887,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":888,"updatedAt":888},121,"Headshot_Zhang.jpg",3300,{"large":865,"small":870,"medium":875,"thumbnail":880},{"ext":761,"url":866,"hash":867,"mime":764,"name":868,"path":13,"size":869,"width":675,"height":675},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/large_Headshot_Zhang_c33d345370.jpg","large_Headshot_Zhang_c33d345370","large_Headshot_Zhang.jpg",64.68,{"ext":761,"url":871,"hash":872,"mime":764,"name":873,"path":13,"size":874,"width":681,"height":681},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/small_Headshot_Zhang_c33d345370.jpg","small_Headshot_Zhang_c33d345370","small_Headshot_Zhang.jpg",23.75,{"ext":761,"url":876,"hash":877,"mime":764,"name":878,"path":13,"size":879,"width":687,"height":687},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/medium_Headshot_Zhang_c33d345370.jpg","medium_Headshot_Zhang_c33d345370","medium_Headshot_Zhang.jpg",42.91,{"ext":761,"url":881,"hash":882,"mime":764,"name":883,"path":13,"size":884,"width":516,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_Headshot_Zhang_c33d345370.jpg","thumbnail_Headshot_Zhang_c33d345370","thumbnail_Headshot_Zhang.jpg",4.2,"Headshot_Zhang_c33d345370",373.05,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/Headshot_Zhang_c33d345370.jpg","2025-05-16T11:20:24.358Z",[],"-174",{"id":892,"contact":893},113,{"id":894,"name":895,"committee":13,"position":13,"affiliation":896,"email":13,"biography":48,"createdAt":897,"updatedAt":898,"url_path_id":899,"contactPhoto":900,"socialLinks":929,"url_path":930},140,"Dr. Savannah Eisner","Department of Electrical Engineering, Columbia University","2025-05-16T11:21:16.493Z","2025-06-02T16:18:30.686Z","199",{"id":901,"name":902,"alternativeText":13,"caption":13,"width":903,"height":903,"formats":904,"hash":925,"ext":761,"mime":764,"size":926,"url":927,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":928,"updatedAt":928},143,"Headshot_Eisner.jpg",3119,{"large":905,"small":910,"medium":915,"thumbnail":920},{"ext":761,"url":906,"hash":907,"mime":764,"name":908,"path":13,"size":909,"width":675,"height":675},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/large_Headshot_Eisner_7bee074d8a.jpg","large_Headshot_Eisner_7bee074d8a","large_Headshot_Eisner.jpg",63.63,{"ext":761,"url":911,"hash":912,"mime":764,"name":913,"path":13,"size":914,"width":681,"height":681},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/small_Headshot_Eisner_7bee074d8a.jpg","small_Headshot_Eisner_7bee074d8a","small_Headshot_Eisner.jpg",24.16,{"ext":761,"url":916,"hash":917,"mime":764,"name":918,"path":13,"size":919,"width":687,"height":687},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/medium_Headshot_Eisner_7bee074d8a.jpg","medium_Headshot_Eisner_7bee074d8a","medium_Headshot_Eisner.jpg",42.51,{"ext":761,"url":921,"hash":922,"mime":764,"name":923,"path":13,"size":924,"width":516,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_Headshot_Eisner_7bee074d8a.jpg","thumbnail_Headshot_Eisner_7bee074d8a","thumbnail_Headshot_Eisner.jpg",4.32,"Headshot_Eisner_7bee074d8a",233.52,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/Headshot_Eisner_7bee074d8a.jpg","2025-06-02T16:18:28.620Z",[],"-175",{"id":932,"contact":933},114,{"id":934,"name":935,"committee":13,"position":13,"affiliation":936,"email":13,"biography":48,"createdAt":937,"updatedAt":937,"url_path_id":938,"contactPhoto":939,"socialLinks":972,"url_path":973},141,"Dr. Sourav Dutta","Department of Electrical and Computer Engineering, University of Texas at Dallas","2025-05-16T11:21:47.538Z","200",{"id":940,"name":941,"alternativeText":13,"caption":13,"width":863,"height":942,"formats":943,"hash":968,"ext":761,"mime":764,"size":969,"url":970,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":971,"updatedAt":971},123,"Headshot_Sourav.jpg",3816,{"large":944,"small":950,"medium":956,"thumbnail":962},{"ext":761,"url":945,"hash":946,"mime":764,"name":947,"path":13,"size":948,"width":949,"height":675},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/large_Headshot_Sourav_d221c4126f.jpg","large_Headshot_Sourav_d221c4126f","large_Headshot_Sourav.jpg",81.43,865,{"ext":761,"url":951,"hash":952,"mime":764,"name":953,"path":13,"size":954,"width":955,"height":681},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/small_Headshot_Sourav_d221c4126f.jpg","small_Headshot_Sourav_d221c4126f","small_Headshot_Sourav.jpg",26.45,432,{"ext":761,"url":957,"hash":958,"mime":764,"name":959,"path":13,"size":960,"width":961,"height":687},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/medium_Headshot_Sourav_d221c4126f.jpg","medium_Headshot_Sourav_d221c4126f","medium_Headshot_Sourav.jpg",51.1,649,{"ext":761,"url":963,"hash":964,"mime":764,"name":965,"path":13,"size":966,"width":967,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_Headshot_Sourav_d221c4126f.jpg","thumbnail_Headshot_Sourav_d221c4126f","thumbnail_Headshot_Sourav.jpg",4.23,135,"Headshot_Sourav_d221c4126f",556.27,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/Headshot_Sourav_d221c4126f.jpg","2025-05-16T11:21:45.400Z",[],"-176",{"id":975,"contact":976},115,{"id":977,"name":978,"committee":13,"position":13,"affiliation":979,"email":13,"biography":48,"createdAt":980,"updatedAt":981,"url_path_id":982,"contactPhoto":983,"socialLinks":1006,"url_path":1007},142,"Dr. Eli Yablonovitch","Department of Electrical Engineering and Computer Sciences, University of California, Berkeley","2025-05-16T11:22:39.232Z","2025-06-02T16:17:26.396Z","201",{"id":934,"name":984,"alternativeText":13,"caption":13,"width":985,"height":985,"formats":986,"hash":1002,"ext":761,"mime":764,"size":1003,"url":1004,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":1005,"updatedAt":1005},"Yablonovitch.jpg",800,{"small":987,"medium":992,"thumbnail":997},{"ext":761,"url":988,"hash":989,"mime":764,"name":990,"path":13,"size":991,"width":681,"height":681},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/small_Yablonovitch_4875e438bf.jpg","small_Yablonovitch_4875e438bf","small_Yablonovitch.jpg",32.26,{"ext":761,"url":993,"hash":994,"mime":764,"name":995,"path":13,"size":996,"width":687,"height":687},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/medium_Yablonovitch_4875e438bf.jpg","medium_Yablonovitch_4875e438bf","medium_Yablonovitch.jpg",70.39,{"ext":761,"url":998,"hash":999,"mime":764,"name":1000,"path":13,"size":1001,"width":516,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_Yablonovitch_4875e438bf.jpg","thumbnail_Yablonovitch_4875e438bf","thumbnail_Yablonovitch.jpg",4.1,"Yablonovitch_4875e438bf",80.1,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/Yablonovitch_4875e438bf.jpg","2025-06-02T16:17:24.182Z",[],"-177",{"id":1009,"contact":1010},116,{"id":901,"name":1011,"committee":13,"position":13,"affiliation":1012,"email":13,"biography":48,"createdAt":1013,"updatedAt":1013,"url_path_id":1014,"contactPhoto":1015,"socialLinks":1029,"url_path":1030},"Dr. Greg Pitner","Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC) ","2025-05-16T11:23:21.903Z","202",{"id":1016,"name":1017,"alternativeText":13,"caption":13,"width":1018,"height":1018,"formats":1019,"hash":1025,"ext":761,"mime":764,"size":1026,"url":1027,"previewUrl":13,"provider":25,"provider_metadata":13,"createdAt":1028,"updatedAt":1028},125,"1516820164992.jpg",200,{"thumbnail":1020},{"ext":761,"url":1021,"hash":1022,"mime":764,"name":1023,"path":13,"size":1024,"width":516,"height":516},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/thumbnail_1516820164992_57c622bf0c.jpg","thumbnail_1516820164992_57c622bf0c","thumbnail_1516820164992.jpg",5.44,"1516820164992_57c622bf0c",7.8,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/drc25/1516820164992_57c622bf0c.jpg","2025-05-16T11:23:19.933Z",[],"-178",{"id":1032,"contact":1033},117,{"id":1034,"name":1035,"committee":13,"position":13,"affiliation":1036,"email":13,"biography":48,"createdAt":1037,"updatedAt":1038,"url_path_id":1039,"contactPhoto":1040,"socialLinks":1068,"url_path":1069},144,"Dr. 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